Lamellae preparation for atomic-resolution STEM imaging from ion-beam-sensitive topological insulator crystals
No Thumbnail Available
Date
2022-04-06
Journal Title
Journal ISSN
Volume Title
Publisher
AIP Publishing
Abstract
Good specimen quality is a key factor in achieving successful scanning transmission electron microscope analysis. Thin and damage-free specimens are prerequisites for obtaining atomic-resolution imaging. Topological insulator single crystals and thin films in the chalcogenide family such as Sb2Te3 are sensitive to electron and ion beams. It is, therefore, challenging to prepare a lamella suitable for high-resolution imaging from these topological insulator materials using standard focused ion-beam instruments. We have developed a modified method to fabricate thin focused ion-beam (FIB) lamellae with minimal ion-beam damage and artefacts. The technique described in the current study enables the reliable preparation of high-quality transmission electron microscope (TEM) specimens necessary for studying ultra-thin surface regions. We have successfully demonstrated that the careful selection of FIB milling parameters at each stage minimizes the damage layer without the need for post-treatment. © 2022 Author(s). Published under an exclusive license by the AVS.
Description
Keywords
Lamellae, Ion beams, Layers, Thin films, Crystals, Transmission electron microscopy
Citation
Bake, A., Zhao, W., Mitchell, D., Wang, X., Nancarrow, M., & Cortie, D. (2022). Lamellae preparation for atomic-resolution STEM imaging from ion-beam-sensitive topological insulator crystals. Journal of Vacuum Science & Technology A, 40(3), 033203. doi:10.1116/6.0001771