The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys

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dc.contributor.authorHao, QCen_AU
dc.contributor.authorTan, XFen_AU
dc.contributor.authorGu, QFen_AU
dc.contributor.authorSweatman, Ken_AU
dc.contributor.authorMcDonald, SDen_AU
dc.contributor.authorNogita, Ken_AU
dc.date.accessioned2023-02-06T23:08:17Zen_AU
dc.date.available2023-02-06T23:08:17Zen_AU
dc.date.issued2022-02-02en_AU
dc.date.statistics2022-09-02en_AU
dc.description.abstractThe different rates of thermal expansion of the many materials that make up an electronic assembly combined with temperature fluctuations are the driver of the thermal fatigue failure of solder joints. A characteristic of the Sn-Bi system, which provided the basis for many of the low process temperature solder alloys that the electronics industry is now adopting, is the very temperature-sensitive solubility of Bi and Sn in the other phase. In this study, in situ synchrotron powder x-ray diffraction was used to characterize the temperature dependence of the lattice parameters of the βSn and Bi phases in Sn-57wt%Bi and Sn-37wt%Bi. The effects of temperature and solute were separated by comparing with the data from pure βSn and pure Bi and verified using density functional theory calculations. Furthermore, the coefficients of thermal expansion of βSn and Bi during heating were also derived to reveal the thermal expansion behavior. © 2022 The Author(s) - Open access under a Creative Commons Attribution Licenseen_AU
dc.description.sponsorshipThis work was supported by Nihon Superior Co., Ltd., Japan (Grant Number 2016001895 and 2021002341); the Australian Research Council (ARC), Australia (Grant Number DP200101949 and LP180100595); Australian Synchrotron beamtime (Grant Number AS211/PD/16842);The University of Queensland, Australia (Grant Number 2021002690). Open Access funding enabled and organized by CAUL and its Member Institutions. We wish to acknowledge the University of Queensland’s Research Computing Center (RCC) and the Australian Synchrotron powder diffraction beamline for their support in this research.en_AU
dc.identifier.citationHao, Q., Tan, X. F., Gu, Q., Sweatman, K., McDonald, S. D., & Nogita, K. (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74(4), 1739-1750. doi:10.1007/s11837-021-05145-4en_AU
dc.identifier.issn1543-1851en_AU
dc.identifier.issue4en_AU
dc.identifier.journaltitleJOMen_AU
dc.identifier.pagination1739-1750en_AU
dc.identifier.urihttps://doi.org/10.1007/s11837-021-05145-4en_AU
dc.identifier.urihttps://apo.ansto.gov.au/dspace/handle/10238/14610en_AU
dc.identifier.volume74en_AU
dc.language.isoenen_AU
dc.publisherSpringer Natureen_AU
dc.subjectThermal expansionen_AU
dc.subjectThermal fatigueen_AU
dc.subjectSoldered jointsen_AU
dc.subjectAlloysen_AU
dc.subjectDensity functional methoden_AU
dc.subjectHeatingen_AU
dc.subjectSolutesen_AU
dc.subjectDiffusionen_AU
dc.titleThe effects of temperature and solute diffusion on volume change in Sn-Bi solder alloysen_AU
dc.typeJournal Articleen_AU
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