The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys
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Date
2022-02-02
Authors
Journal Title
Journal ISSN
Volume Title
Publisher
Springer Nature
Abstract
The different rates of thermal expansion of the many materials that make up an electronic assembly combined with temperature fluctuations are the driver of the thermal fatigue failure of solder joints. A characteristic of the Sn-Bi system, which provided the basis for many of the low process temperature solder alloys that the electronics industry is now adopting, is the very temperature-sensitive solubility of Bi and Sn in the other phase. In this study, in situ synchrotron powder x-ray diffraction was used to characterize the temperature dependence of the lattice parameters of the βSn and Bi phases in Sn-57wt%Bi and Sn-37wt%Bi. The effects of temperature and solute were separated by comparing with the data from pure βSn and pure Bi and verified using density functional theory calculations. Furthermore, the coefficients of thermal expansion of βSn and Bi during heating were also derived to reveal the thermal expansion behavior. © 2022 The Author(s) - Open access under a Creative Commons Attribution License
Description
Keywords
Thermal expansion, Thermal fatigue, Soldered joints, Alloys, Density functional method, Heating, Solutes, Diffusion
Citation
Hao, Q., Tan, X. F., Gu, Q., Sweatman, K., McDonald, S. D., & Nogita, K. (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74(4), 1739-1750. doi:10.1007/s11837-021-05145-4