Etch rates for (100) gallium arsenide using aqueous h2so4h2o and aqua regia based etchants.
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Date
1991-09
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Publisher
Australian Nuclear Science and Technology Organisation
Abstract
Etch rate experiments were carried out for (100) GaAs using etching solutions of H2SO4 :H2O2 :H2O (3:1:1 3:1:15) HCl:HNO3 (3:1) HCl:HNO3 :H2O (1: 1:1) and HCl:HNO3 :glycerol (with various dilutions of glycerol). Several differences were seen for the (100) plane compared to previous results for other crystal orientations. The sulphuric acid solutions showed much lower activation energies for etching the (100) plane. The HCl:HNO3 :glycerol solutions showed considerably lower etch rates for the (100) plane probably indicating that they etch GaAs anisotropically. For a 1:1:2 solution of HCl:HNO3 :glycerol a decrease in the etch rate of (100) GaAs was observed in the presence of stirring. This is the opposite result to what is commonly assumed for this polishing etchant. It indicates that the main polishing process attributed to this etchant is not present and in fact the polishing quality of the etchant is probably limited by the etching process which is present.
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Keywords
Gallium arsenides, Aqueous solutions, Aqua regia, Etching, Activation energy, Sulfuric acid, Stirring
Citation
Keane, M., Butcher, K., Alexiev, D. (1991). Etch rates for (100) gallium arsenide using aqueous h2so4h2o and aqua regia based etchants (ANSTO/E699). Lucas Heights, N.S.W.: Australian Nuclear Science and Technology Organisation