Please use this identifier to cite or link to this item: https://apo.ansto.gov.au/dspace/handle/10238/8151
Title: Interpenetration as a mechanism for negative thermal expansion in the metal–organic framework Cu3(btb)2 (MOF-14)
Authors: Wu, Y
Peterson, VK
Luks, E
Darwish, TA
Kepert, CJ
Keywords: Thermal expansion
Metals
Mechanical properties
Monocrystals
Diffraction
Crystal structure
Issue Date: 1-Apr-2014
Citation: Wu, Y., Peterson, V. K., Luks, E., Darwish, T. A., & Kepert, C. J. (2014). Interpenetration as a mechanism for negative thermal expansion in the metal–organic framework Cu3(btb)2 (MOF-14. 53(20), 5175-5178. doi:10.1002/anie.201311055
Abstract: Metal–organic framework materials (MOFs) have recently been shown in some cases to exhibit strong negative thermal expansion (NTE) behavior, while framework interpenetration has been found to reduce NTE in many materials. Using powder and single-crystal diffraction methods we investigate the thermal expansion behavior of interpenetrated Cu3(btb)2 (MOF-14) and find that it exhibits an anomalously large NTE effect. Temperature-dependent structural analysis shows that, contrary to other interpenetrated materials, in MOF-14 the large positive thermal expansion of weak interactions that hold the interpenetrating networks together results in a low-energy contractive distortion of the overall framework structure, demonstrating a new mechanism for NTE. © 2014, WILEY‐VCH Verlag GmbH & Co. KGaA.
Gov't Doc #: 7694
URI: https://doi.org/10.1002/anie.201311055
http://apo.ansto.gov.au/dspace/handle/10238/8151
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