Interpenetration as a mechanism for negative thermal expansion in the metal–organic framework Cu3(btb)2 (MOF-14)

Simple item page
dc.contributor.authorWu, Yen_AU
dc.contributor.authorPeterson, VKen_AU
dc.contributor.authorLuks, Een_AU
dc.contributor.authorDarwish, TAen_AU
dc.contributor.authorKepert, CJen_AU
dc.date.accessioned2016-12-13T00:41:26Zen_AU
dc.date.available2016-12-13T00:41:26Zen_AU
dc.date.issued2014-04-01en_AU
dc.date.statistics2014-05-12en_AU
dc.description.abstractMetal–organic framework materials (MOFs) have recently been shown in some cases to exhibit strong negative thermal expansion (NTE) behavior, while framework interpenetration has been found to reduce NTE in many materials. Using powder and single-crystal diffraction methods we investigate the thermal expansion behavior of interpenetrated Cu3(btb)2 (MOF-14) and find that it exhibits an anomalously large NTE effect. Temperature-dependent structural analysis shows that, contrary to other interpenetrated materials, in MOF-14 the large positive thermal expansion of weak interactions that hold the interpenetrating networks together results in a low-energy contractive distortion of the overall framework structure, demonstrating a new mechanism for NTE. © 2014, WILEY‐VCH Verlag GmbH & Co. KGaA.en_AU
dc.identifier.citationWu, Y., Peterson, V. K., Luks, E., Darwish, T. A., & Kepert, C. J. (2014). Interpenetration as a mechanism for negative thermal expansion in the metal–organic framework Cu3(btb)2 (MOF-14). Angewandte Chemie International Edition, 53(20), 5175-5178. doi:10.1002/anie.201311055en_AU
dc.identifier.govdoc7694en_AU
dc.identifier.issn1433-7851en_AU
dc.identifier.issue20en_AU
dc.identifier.journaltitleAngewandte Chemie International Editionen_AU
dc.identifier.pagination5175-5178en_AU
dc.identifier.urihttps://doi.org/10.1002/anie.201311055en_AU
dc.identifier.urihttp://apo.ansto.gov.au/dspace/handle/10238/8151en_AU
dc.identifier.volume53en_AU
dc.language.isoenen_AU
dc.publisherWileyen_AU
dc.subjectThermal expansionen_AU
dc.subjectMetalsen_AU
dc.subjectMechanical propertiesen_AU
dc.subjectMonocrystalsen_AU
dc.subjectDiffractionen_AU
dc.subjectCrystal structureen_AU
dc.titleInterpenetration as a mechanism for negative thermal expansion in the metal–organic framework Cu3(btb)2 (MOF-14)en_AU
dc.typeJournal Articleen_AU
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
ange.201311055.pdf
Size:
500.17 KB
Format:
Adobe Portable Document Format
Description:
Download
License bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description:
Download
Collections
Journal Articles