The effect of grain size and dislocation density on the tensile properties of Ni-SiCNP composites during annealing

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dc.contributor.authorYang, Cen_AU
dc.contributor.authorHuang, HFen_AU
dc.contributor.authorThorogood, GJen_AU
dc.contributor.authorJiang, Len_AU
dc.contributor.authorYe, XXen_AU
dc.contributor.authorLi, ZJen_AU
dc.contributor.authorZhou, XTen_AU
dc.date.accessioned2022-04-21T06:23:39Zen_AU
dc.date.available2022-04-21T06:23:39Zen_AU
dc.date.issued2016-02-12en_AU
dc.date.statistics2022-04-04en_AU
dc.description.abstractThe grain size refinement, enhancement of mechanical properties, and static recrystallization behavior of metallic nickel-silicon carbide nano-particle (Ni-3wt.%SiCNP) composites, milled for times ranging from 8 to 48 h have been examined. One set of Ni-SiCNP composite samples were annealed at 300 °C for 250 h, while the other set of samples were maintained at room temperature for control purposes (reference). The electron backscatter diffraction results indicate that the grain size of the annealed Ni-SiCNP composite was refined due to grain restructuring during static recrystallization. The x-ray diffraction results indicate that low-temperature annealing effectively reduced the density of dislocations; this can be explained by the dislocation pile-up model. Additionally, the tensile tests indicated that the annealed Ni-SiCNP composite had a significant increase in strength due to an increase of the Hall–Petch strengthening effect with a slight increase in the total elongation. The decrease of dislocation pile-up in the grain interiors and the increase in grain boundary sliding are assumed to be the main mechanisms at play. The relationship between the microstructural evolution and the variation of tensile properties is examined in this study. © 2016 ASM International. Published by Springer Nature.en_AU
dc.description.sponsorshipThe authors gratefully acknowledge the financial support of the project from the China-Australia Joint Research Project (Grant No. 2014DFG60230), Scientific Research Foundation for Returned Scholars, Ministry of Education of China, National Natural Science Foundation of China (Grant No. 51371188) and “Strategic Priority Research Program” of the Chinese Academy of Sciences (Grant No. XDA02004210).en_AU
dc.identifier.citationYang, C., Huang, H., Thorogood, G. J., Jiang, L., Ye, X., Li, Z., & Zhou, X. (2016). The effect of grain size and dislocation density on the tensile properties of Ni-SiCNP composites during annealing. Journal of Materials Engineering and Performance, 25(3), 726-733. doi:10.1007/s11665-016-1938-2en_AU
dc.identifier.issn1059-9495en_AU
dc.identifier.issue3en_AU
dc.identifier.journaltitleJournal of Materials Engineering and Performanceen_AU
dc.identifier.pagination726-733en_AU
dc.identifier.urihttps://doi.org/10.1007/s11665-016-1938-2en_AU
dc.identifier.urihttps://apo.ansto.gov.au/dspace/handle/10238/13056en_AU
dc.identifier.volume25en_AU
dc.language.isoenen_AU
dc.publisherSpringer Natureen_AU
dc.subjectBurgers vectoren_AU
dc.subjectDislocationsen_AU
dc.subjectAnnealingen_AU
dc.subjectRecrystallizationen_AU
dc.subjectGrain sizeen_AU
dc.subjectTensile propertiesen_AU
dc.subjectNanoparticlesen_AU
dc.subjectNickel compoundsen_AU
dc.titleThe effect of grain size and dislocation density on the tensile properties of Ni-SiCNP composites during annealingen_AU
dc.typeJournal Articleen_AU
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