The effects of Bi addition on the mechanical properties of eutectic Sn-Ag-Cu lead-free solder alloy

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dc.contributor.authorOlofinjana, Aen_AU
dc.contributor.authorShewchenko, Len_AU
dc.contributor.authorMata, JPen_AU
dc.contributor.authorHaque, Ren_AU
dc.date.accessioned2023-05-04T22:35:12Zen_AU
dc.date.available2023-05-04T22:35:12Zen_AU
dc.date.issued2020-11-11en_AU
dc.date.statistics2023-04-24en_AU
dc.description.abstractSn-Ag-Cu (SAC) solders are gaining momentum as the choice of Pb free electrical interconnect materials because of the legislative restrictions on the use of hazardous materials in electronic devices. However, SAC has high melting temperatures around 217oC. The role of Bi substitution to lowering solder joint processing temperatures are widely considered because of the low-temperature Sn-Bi eutectic. However, the embrittling effects of Bi addition require clarification on the maximum limits of substitution. In this work, the mechanical properties of eutectic SAC with gradual Bi substitution up to 10wt.% Bi was followed. It is shown that fracture strength (σ_f) increases from 50MPa plateauing at 60MPa between 1.4 and 1.8%Bi representing the limits of solid solution strengthening. Over this substitution range, strain at fracture (ε_f) dropped from 30% to 10% and reduction in area (RA) dropped from 80% to less than 5%. The σ_f was nearly 80MPa for 2%Bi and this increases gradually with %Bi concentration peaking at 93MPa for 7%Bi. Results of thermal analysis suggested that solidification went off eutectic after Bi concentration exceeded 2%. Using neutron diffraction techniques, the lattice parameter measurements suggest that the solubility limit of Bi in β Sn (in the multicomponent Sn-Ag-Cu) is about 2wt. %. The existence of Bi rich clusters was responsible for observed brittleness after 2wt.% Bi substitution. With the aid small angle neutron Scattering (SANS) and ultra-small angle neutron scattering (USANS), it was found that the intensity changes with respect to scattering factor (Q) especially for high Q region when the precipitations sizes are below 12.5 nm after concentration exceeded 2%Bi that confirms the existence of primary nanosized Bi precipitates that starts to grow into well-defined Bi phases for higher Bi content.en_AU
dc.identifier.citationOlofinjana, A., Shewchenko, L., Mata, J., & Haque, R. (2020). The effects of Bi addition on the mechanical properties of eutectic Sn-Ag-Cu lead-free solder alloy. Paper presented to the ANBUG-AINSE Neutron Scattering Symposium, AANSS 2020, Virtual Meeting, 11th - 13th November 2020, (pp. 50). Retrieved from: https://events01.synchrotron.org.au/event/125/attachments/725/1149/AANSS_Abstract_Booklet_Complete_-_1_Page_Reduced.pdfen_AU
dc.identifier.conferenceenddate13 November 2020en_AU
dc.identifier.conferencenameANBUG-AINSE Neutron Scattering Symposium, AANSS 2020en_AU
dc.identifier.conferenceplaceVirtual Meetingen_AU
dc.identifier.conferencestartdate11 November 2020en_AU
dc.identifier.pagination50en_AU
dc.identifier.urihttps://events01.synchrotron.org.au/event/125/contributions/3753/contribution.pdfen_AU
dc.identifier.urihttps://apo.ansto.gov.au/dspace/handle/10238/14984en_AU
dc.language.isoenen_AU
dc.publisherAustralian Institute of Nuclear Science and Engineering (AINSE)en_AU
dc.subjectLeaden_AU
dc.subjectMeltingen_AU
dc.subjectFracturesen_AU
dc.subjectSolid solutionsen_AU
dc.subjectHazardous materialsen_AU
dc.subjectSmall angle scatteringen_AU
dc.subjectConcentration ratioen_AU
dc.subjectMaterialsen_AU
dc.subjectAlloysen_AU
dc.subjectSolubilityen_AU
dc.titleThe effects of Bi addition on the mechanical properties of eutectic Sn-Ag-Cu lead-free solder alloyen_AU
dc.typeConference Abstracten_AU
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