The effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free solders

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dc.contributor.authorRaza, Men_AU
dc.contributor.authorShewchenko, Len_AU
dc.contributor.authorOlofinjana, Aen_AU
dc.contributor.authorKent, Den_AU
dc.contributor.authorMata, JPen_AU
dc.contributor.authorHaque, Ren_AU
dc.date.accessioned2023-11-07T04:48:36Zen_AU
dc.date.available2023-11-07T04:48:36Zen_AU
dc.date.issued2021-08-02en_AU
dc.date.statistics2023-11-07en_AU
dc.description.abstractPb-free solders are gaining ground as the optimum choice for electrical interconnect materials, however, their higher melting temperature around 217 °C is still an issue that restricts wider adoption. The potential to employ Bi substitution for Sn to lower solder joint processing temperatures has been widely considered. In this work, the mechanical properties of eutectic SAC with gradually increasing Bi substitution up to 10 wt% Bi was studied. It is shown that fracture strength (σf) increases with Bi additions from 50 MPa plateauing at 60 MPa between 1.4 and 1.8% Bi which represents the limits of solid solution strengthening. Over this substitutional range, strain at fracture (εf) dropped from 30 to 10% which was also evidenced by smaller percentage reduction in area (%RA). The σf was nearly 80 MPa for 2% Bi increasing gradually with increasing Bi concentrations and peaking at 93 MPa for 7% Bi whilst maintaining 10% elongation at fracture. X-ray diffraction and DSC thermal studies suggests that the solubility limit of Bi in β-Sn (in the multicomponent SAC) is less than 2 wt% Bi. With the aid of small-angle neutron Scattering (SANS) and ultra-small-angle neutron scattering (USANS), it was found that the scattering intensity changes for alloys with Bi content in the range 0.8 – 1.5wt% compared to ternary SAC with less than 0.8% Bi at low scattering factors (Q > 10 - 2Å - 1) signifying microstructural differences at length scales of the order of 10–100 nm. There were no differences observed in scattering for alloy samples with more than 2 wt% Bi. © 2021, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.en_AU
dc.description.sponsorshipThe authors acknowledge AINSE for awarding grant No. 8285 to carry out neutron diffraction studies at ANSTO.en_AU
dc.identifier.citationRaza, M., Shewchenko, L., Olofinjana, A., Kent, D., Mata, J., & Haque, R. (2021). The effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free solders. Journal of Materials Science: Materials in Electronics, 32, 22155-22167. doi:10.1007/s10854-021-06691-yen_AU
dc.identifier.issn1573-482Xen_AU
dc.identifier.journaltitleJournal of Materials Science: Materials in Electronicsen_AU
dc.identifier.pagination22155-22167en_AU
dc.identifier.urihttps://apo.ansto.gov.au/handle/10238/15174en_AU
dc.identifier.volume32en_AU
dc.language.isoenen_AU
dc.publisherSpringer Natureen_AU
dc.relation.urihttps://doi.org/10.1007/s10854-021-06691-yen_AU
dc.subjectLeaden_AU
dc.subjectNeutron diffractionen_AU
dc.subjectMetallographyen_AU
dc.subjectSolderingen_AU
dc.subjectBismuthen_AU
dc.subjectFracturesen_AU
dc.subjectMicrostructureen_AU
dc.titleThe effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free soldersen_AU
dc.typeJournal Articleen_AU
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