AFM and ellipsometry studies of ultra thin Ti film deposited on a silicon wafer

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dc.contributor.authorLin, BJen_AU
dc.contributor.authorZhu, HTen_AU
dc.contributor.authorTieu, AKen_AU
dc.contributor.authorTriani, Gen_AU
dc.date.accessioned2016-09-15T00:49:21Zen_AU
dc.date.available2016-09-15T00:49:21Zen_AU
dc.date.issued2013-11-11en_AU
dc.date.statistics2016-09-15en_AU
dc.description.abstractAn ultra- thin Ti film with a thickness of less than 30 nm was deposited on the surface of a silicon wafer by the filtered arc deposition system. A novel technique was adopted to create a height step between the coated area and non-coated area (silicon wafer) during deposition. The surface morphology and thickness of the film was detected by atomic force microscopy (AFM). The AFM results showed that the deposited film formed a smooth structure on the silicon wafer and the height step between the coating and silicon wafer was clear enough to give the thickness of the deposited film. The composition of the deposited film was detected by a combined use of Ellipsometry and AFM. Natural oxidisation of Ti (TiO2) was found on the top of the Ti film after deposition, and the thickness of TiO2 was determined by ellipsometry to be about 0.6 nm. Trans Tech Publications. © 2014, Trans Tech Publications.en_AU
dc.identifier.citationLin, B. J., Zhu, H. T., Tieu, A. K., & Triani, G. (2014). AFM and ellipsometry studies of ultra thin Ti film deposited on a silicon wafer. Materials Science Forum, 773-774, 616-625 doi:10.4028/www.scientific.net/MSF.773-774.616en_AU
dc.identifier.govdoc7100en_AU
dc.identifier.issn1662-9752en_AU
dc.identifier.journaltitleMaterials Science Forumen_AU
dc.identifier.pagination616-625en_AU
dc.identifier.urihttp://dx.doi.org/10.4028/www.scientific.net/MSF.773-774.616en_AU
dc.identifier.urihttp://apo.ansto.gov.au/dspace/handle/10238/7518en_AU
dc.identifier.volume773-774en_AU
dc.language.isoenen_AU
dc.publisherTans Tech Publications Ltden_AU
dc.subjectCoatingsen_AU
dc.subjectDepositionen_AU
dc.subjectEllipsometryen_AU
dc.subjectThicknessen_AU
dc.subjectSiliconen_AU
dc.subjectMorphologyen_AU
dc.titleAFM and ellipsometry studies of ultra thin Ti film deposited on a silicon waferen_AU
dc.typeJournal Articleen_AU
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