Evaluation of interfacial toughness and bond strength of sandwiched silicon structures

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dc.contributor.authorLatella, BAen_AU
dc.contributor.authorNicholls, TWen_AU
dc.contributor.authorCassidy, DJen_AU
dc.contributor.authorBarbé, CJen_AU
dc.contributor.authorTriani, Gen_AU
dc.date.accessioned2025-12-12T02:49:19Zen_AU
dc.date.available2025-12-12T02:49:19Zen_AU
dc.date.issued2002-05-31en_AU
dc.date.statistics2025-11-12en_AU
dc.description.abstractResults of a study to measure the interfacial strength and toughness in sandwiched silicon structures, using sol-gel processing as the bonding method, are examined. The interfacial bond strength was determined using a standard uniaxial tensile test, while a relative measure of interface toughness was ascertained using exploratory Vickers indentations. The specimens were positioned and aligned so that the indentations were made directly on the interface region, with the cracks emanating from one set of the impression diagonals at the free surface coinciding with the trace of the interface. The length of these radial cracks, having a penny-like configuration, required to cause debonding at the interface was measured in order to provide relative fracture toughness and fracture energy values. Indications of 'local' bond toughness were obtained by indenting at locations near the interface and following the path of the radial cracks. The applicability of the technique with reference to material interfaces is discussed. © 2002 Elsevier Science B.V.en_AU
dc.identifier.citationLatella, B. A., Nicholls, T. W., Cassidy, D. J., Barbé, C. J., & Triani, G. (2002). Evaluation of interfacial toughness and bond strength of sandwiched silicon structures. Thin Solid Films, 411(2), 247–255. doi:10.1016/S0040-6090(02)00331-0en_AU
dc.identifier.issn0040-6090en_AU
dc.identifier.issue2en_AU
dc.identifier.journaltitleThin Solid Filmsen_AU
dc.identifier.pagination247-255en_AU
dc.identifier.urihttps://doi.org/10.1016/s0040-6090(02)00331-0en_AU
dc.identifier.urihttps://apo.ansto.gov.au/handle/10238/16782en_AU
dc.identifier.volume411en_AU
dc.languageEnglishen_AU
dc.language.isoenen_AU
dc.publisherElsevieren_AU
dc.subjectSiliconen_AU
dc.subjectMaterialsen_AU
dc.subjectTensile propertiesen_AU
dc.subjectTestingen_AU
dc.subjectCracksen_AU
dc.subjectConfigurationen_AU
dc.subjectVickers hardnessen_AU
dc.subjectCracksen_AU
dc.subjectSol-gel processen_AU
dc.titleEvaluation of interfacial toughness and bond strength of sandwiched silicon structuresen_AU
dc.typeJournal Articleen_AU
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