Characterization of the residual stresses introduced by a new joining method in diamond and tungsten carbide composites

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dc.contributor.authorLavigne, Oen_AU
dc.contributor.authorLuzin, Ven_AU
dc.contributor.authorMendez, Men_AU
dc.contributor.authorMalik, ASen_AU
dc.contributor.authorRosas-Carrasco, Oen_AU
dc.contributor.authorSalvemini, Fen_AU
dc.date.accessioned2023-11-21T23:44:24Zen_AU
dc.date.available2023-11-21T23:44:24Zen_AU
dc.date.issued2019-05-29en_AU
dc.date.statistics2023-06-28en_AU
dc.description.abstractIn this work, a co-sintering method was used to attach diamond to cemented carbide composites. The joining method consists of sintering a green part (ring) of cemented carbide (CC) around a thermally stable diamond composite (TSDC) part (plug) to radially contain it. During the sintering step, the green body shrinks to a controlled level and therefore forms interference fit between the two parts (mismatch between the inner diameter (ID) of the CC ring and the outer diameter (OD) of the TSDC cylinder). The residual stresses induced by this process as well as the bond strength between the CC and the TSDC parts were quantitatively evaluated. It is shown that the interface pressure between the two parts, and the level of residual stresses, increased with increase in the designed interference fit, as well as with the increase of the ID/OD ratios of the CC ring. For the chosen material combination (cemented carbide ring comprised 90 vol% WC and 10 vol% Co with medium coarse WC grains; diamond composite plug comprised 84 vol% diamond and 16 vol% SiC), the values of the hoop stresses at the interface in the CC ring measured by neutron diffraction was determined to be between 150 MPa and 550 MPa, depending on the ID/OD ratio. It was also found that for a given ID/OD ratio, the increase of the designed interference fit had little effect on that attained due to the plastic deformation of the cemented carbide material at the interface during the sintering (dynamic) process. A mechanical bond around 60 MPa was nevertheless achieved.en_AU
dc.identifier.booktitleInternational Technical Conference on Diamond, Cubic Boron Nitride and Their Applications (INTERTECH 2019), New Orlenes, Louisiana, USA, 29 - 31 May 2-19en_AU
dc.identifier.citationLavigne, O., Luzin, V., Mendez, M., Malik, A.-S., Carrasco, O., & Salvemini, F. (2019). Characterization of the residual stresses introduced by a new joining method in diamond and tungsten carbide composites. Paper presented to the INTERTECH 2019, International Conference on Industrial Diamond, Cubic Boron Nitride and Their Applications, New Orleans, Louisiana, USA, 29 - 31 May 2019. In International Technical Conference on Diamond, Cubic Boron Nitride and Their Applications (INTERTECH 2019), New Orlenes, Louisiana, USA, 29 - 31 May 2-19. Curran Associates, Inc., (pp. 290-295). Retrieved from: https://www.proceedings.com/52915.htmlen_AU
dc.identifier.conferenceenddate2019-05-31en_AU
dc.identifier.conferencenameINTERTECH 2019, International Conference on Industrial Diamond, Cubic Boron Nitride and Their Applicationsen_AU
dc.identifier.conferenceplaceNew Orleans, Louisianaen_AU
dc.identifier.conferencestartdate2019-05-29en_AU
dc.identifier.isbn9781713803508en_AU
dc.identifier.pagination290-295en_AU
dc.identifier.urihttps://apo.ansto.gov.au/handle/10238/15227en_AU
dc.language.isoenen_AU
dc.publisherCurran Associates, Inc.en_AU
dc.relation.urihttps://www.proceedings.com/52915.htmlen_AU
dc.subjectDiamondsen_AU
dc.subjectCermetsen_AU
dc.subjectNeutron diffractionen_AU
dc.subjectResidual stressesen_AU
dc.subjectBondingen_AU
dc.subjectDeformationen_AU
dc.titleCharacterization of the residual stresses introduced by a new joining method in diamond and tungsten carbide compositesen_AU
dc.typeConference Paperen_AU
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