Immobilization of iodine via copper iodide

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dc.contributor.authorVance, ERen_AU
dc.contributor.authorGrant, Cen_AU
dc.contributor.authorKaratchevtseva, Ien_AU
dc.contributor.authorAly, Zen_AU
dc.contributor.authorStopic, Aen_AU
dc.contributor.authorHarrison, JJen_AU
dc.contributor.authorThorogood, GJen_AU
dc.contributor.authorWong, HKYen_AU
dc.contributor.authorGregg, DJen_AU
dc.date.accessioned2022-04-21T05:50:30Zen_AU
dc.date.available2022-04-21T05:50:30Zen_AU
dc.date.issued2018-07en_AU
dc.date.statistics2022-03-31en_AU
dc.description.abstractCuI is a candidate wasteform for the immobilization of the fission product 129I. CuI can be made simply by the addition of CuCl to an I− bearing solution such that exchange of Cl− with I− takes place. The CuI material can then be consolidated into a wasteform by sintering at approximately 550 °C in argon or by hot isostatically pressing at 550 °C with 100 MPa of pressure. A waste loading of greater than 60 wt.% is achievable with good water leach resistance, in keeping with the low solubility product of CuI. However, like the well known wasteform candidate AgI, CuI decomposes in water containing metallic Fe. To compensate this deficiency, the sintered CuI wasteform can be further protected by surrounding it by Sn powder and HIPing at the low temperature of 200 °C. © 2018 Elsevier B.Ven_AU
dc.identifier.citationVance, E. R., Grant, C., Karatchevtseva, I., Aly, Z., Stopic, A., Harrison, J., Thorogood, G. J., Wong, H. K. Y. & Gregg, D. J. (2018). Immobilization of iodine via copper iodide. Journal of Nuclear Materials, 505, 143-148. doi:10.1016/j.jnucmat.2018.04.002en_AU
dc.identifier.issn0022-3115en_AU
dc.identifier.journaltitleJournal of Nuclear Materialsen_AU
dc.identifier.pagination143-148en_AU
dc.identifier.urihttps://doi.org/10.1016/j.jnucmat.2018.04.002en_AU
dc.identifier.urihttps://apo.ansto.gov.au/dspace/handle/10238/13053en_AU
dc.identifier.volume505en_AU
dc.language.isoenen_AU
dc.publisherElsevieren_AU
dc.subjectIodineen_AU
dc.subjectCopper iodidesen_AU
dc.subjectWaste formsen_AU
dc.subjectSolidificationen_AU
dc.subjectSinteringen_AU
dc.subjectHot pressingen_AU
dc.titleImmobilization of iodine via copper iodideen_AU
dc.typeJournal Articleen_AU
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