Low temperature bonding of ceramics by sol-gel processing

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dc.contributor.authorBarbé, CJen_AU
dc.contributor.authorCassidy, DJen_AU
dc.contributor.authorTriani, Gen_AU
dc.contributor.authorLatella, BAen_AU
dc.contributor.authorMitchell, DRMen_AU
dc.contributor.authorFinnie, KSen_AU
dc.contributor.authorBartlett, JRen_AU
dc.contributor.authorWoolfrey, JLen_AU
dc.contributor.authorCollins, GAen_AU
dc.date.accessioned2025-10-03T02:58:43Zen_AU
dc.date.available2025-10-03T02:58:43Zen_AU
dc.date.issued2000-12en_AU
dc.date.statistics2025-09-17en_AU
dc.description.abstractSol-gel bonds were produced between smooth, clean silicon or polycrystalline alumina substrates by spin-coating solutions containing partially hydrolysed silicon alkoxides onto both substrates. The two coated substrates were assembled and the resulting sandwich was fired at temperatures ranging from 300 to 600°C. The influence of the sol-gel chemistry on the film microstructure and interfacial fracture energy was investigated using a wide range of techniques, including ellipsometry, FTIR, TG-DTA, rheology, TEM and micro-indentation. For silicon wafers, an optimum water-alkoxide molar ratio of 10 and hydrolysis water pH of 2 were found. Such conditions led to relatively dense films (>90%), resulting in bonds with significantly higher fracture energy (3.5 J/m2) than those obtained using classical water bonding (typically 1.5 J/m2). Aging of the coating solution was found to decrease the bond strength. Poly-crystalline alumina substrates were similarly bonded at 600°C; the optimised silica sol-gel chemistry yielded interfaces with fracture energy of 4 J/m2. © 2000 Kluwer Academic Publishers.en_AU
dc.identifier.booktitle10th International Workshop on Glass and Ceramics, Hybrids & Nanocomposites from Gels : SOL-GEL '99 : Yokohama Symposia, Yokohama, Japan, September 19-24, 1999en_AU
dc.identifier.citationBarbé, C. J., Cassidy, D. J., Triani, G., Latella, B. A., Mitchell, D. R. M., Finnie, K. S., Bartlett, J. R., Woolfrey, J. L., & Collins, G. A. (2000). Low temperature bonding of ceramics by dol-gel processing. Paper presented to 10th International Workshop on Glass and Ceramics, Hybrids & Nanocomposites from Gels : SOL-GEL '99 : Yokohama Symposia, Yokohama, Japan, September 19-24, 1999. In Journal of Sol-Gel Science and Technology, 19(1), 321–324. doi:10.1023/A:1008733632163en_AU
dc.identifier.conferenceenddate1999-09-24en_AU
dc.identifier.conferencename10th International Workshop on Glass and Ceramics, Hybrids and Nanocomposites from Gels : SOL-GEL '99en_AU
dc.identifier.conferenceplaceYokohama, Japanen_AU
dc.identifier.conferencestartdate1999-09-10en_AU
dc.identifier.issn0928-0707en_AU
dc.identifier.issn1573-4846en_AU
dc.identifier.issue1-3en_AU
dc.identifier.journaltitleJournal of Sol-Gel Science and Technologyen_AU
dc.identifier.pagination321-324en_AU
dc.identifier.urihttps://doi.org/10.1023/a:1008733632163en_AU
dc.identifier.urihttps://apo.ansto.gov.au/handle/10238/16586en_AU
dc.identifier.volume19en_AU
dc.languageEnglishen_AU
dc.language.isoenen_AU
dc.publisherKluwer Academic Publishersen_AU
dc.subjectTemperature rangeen_AU
dc.subjectSol-gel processen_AU
dc.subjectCeramicsen_AU
dc.subjectMicrostructureen_AU
dc.subjectSiliconen_AU
dc.subjectAlkoxidesen_AU
dc.subjectChemistryen_AU
dc.subjectSubstratesen_AU
dc.subjectCoatingsen_AU
dc.subjectFilmsen_AU
dc.subjectSilicaen_AU
dc.subjectTemperature rangeen_AU
dc.subjectPolymersen_AU
dc.titleLow temperature bonding of ceramics by sol-gel processingen_AU
dc.typeConference Paperen_AU
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