Please use this identifier to cite or link to this item: https://apo.ansto.gov.au/dspace/handle/10238/9763
Title: Mechanical properties and adhesion characteristics of hybrid sol–gel thin films
Authors: Atanacio, AJ
Latella, BA
Barbé, CJ
Swain, MV
Keywords: Adhesion
Fractures
Sol-gel process
Elastic properties
Creep
Silicon
Copper
Issue Date: 28-Jul-2004
Publisher: Elsevier
Citation: Atanacio, A. J., Latella, B. A., Barbé, C. J., & Swain, M. V. (2005). Mechanical properties and adhesion characteristics of hybrid sol–gel thin films. Surface and Coatings Technology, 192(2-3), 354-364. doi:10.1016/j.surfcoat.2004.06.004
Abstract: The hardness and Young's modulus of organic–inorganic hybrid coatings, synthesised using sol–gel technology, deposited on silicon and copper were determined using indentations at low forces with a spherical tipped indenter and found to depend strongly on the size of the organic substituent. The indentation creep response of the coating systems was compared based on fast loading rates and for different times at maximum load. The adhesion characteristics of the coatings on copper were examined to ascertain the influence of the organic substituents on the film cracking behaviour and debond tendencies. For this purpose, coated tensile test specimens were strained uniaxially in a universal testing machine while the surface was examined using an optical microscope. The mechanical response was analysed from the multiple cracking patterns observed and the extent of film delamination from the underlying substrate. The results indicate that the interfacial adhesion and film toughness are dramatically affected by the nature of the organic substituent. © 2004 Elsevier B.V
Gov't Doc #: 9821
URI: https://doi.org/10.1016/j.surfcoat.2004.06.004
http://apo.ansto.gov.au/dspace/handle/10238/9763
ISSN: 0257-8972
Appears in Collections:Journal Articles

Files in This Item:
There are no files associated with this item.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.