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A validated numerical model for residual stress predictions in an eight-pass-welded stainless steel plate

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Trans Tech Publications

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Welding processes create a complex transient state of temperature that results in post-weld residual stresses. The current work presents a finite element (FE) analysis of the residual stress distribution in an eight-pass slot weld, conducted using a 316L austenitic stainless steel plate with 308L stainless steel filler metal. A thermal FE model is used to calibrate the transient thermal profile applied during the welding process. Time-resolved body heat flux data from this model is then used in a mechanical FE analysis to predict the resultant post-weld residual stress field. The mechanical analysis made use of the Lemaitre-Chaboche mixed isotropic-kinematic work-hardening model to accurately capture the constitutive response of the 316L weldment during the simulated multi-pass weld process, which results in an applied cyclic thermo-mechanical loading. The analysis is validated by contour method measurements performed on a representative weld specimen. Reasonable agreement between the predicted longitudinal residual stress field and contour measurement is observed, giving confidence in the results of measurements and FE weld model presented.

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Patel, V. I., Muránsky, O., Hamelin, C. J., Olson, M. D., Hill, M. R., & Edwards, L. (2014). A validated numerical model for residual stress predictions in an eight-pass-welded stainless steel plate. Paper presented to the MECA SENS 2013 : 7th International Conference on Mechanical Stress Evaluation by Neutron and Synchrotron Radiation, 10-12 September 2013, Sydney, Australia. In Thomas, M Holden, Onrej Muránsky & Corey J. Hamelin (Eds,), Mechanical stress evaluation by neutrons and synchrotron radiation VII : selected, peer reviewed papers from the 7th International Conference on Mechanical Stress Evaluation by Neutrons and Synchrotron Radiation (MECA SENS VII 2013), September 10-12, 2013, Sydney, Australia, Durnten-Zurich, Switzerland : Trans Tech Publications Ltd. (Materials Science Forum, 777, 46-51. doi:10.4028/www.scientific.net/MSF.777.46

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