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Title: Determination of the residual stress field around scratches using synchrotron x-rays and nanoindentation.
Authors: Khan, MK
Fitzpatrick, ME
Edwards, L
Hainsworth, SV
Keywords: Residual Stresses
X-Ray Diffraction
Crack Propagation
Issue Date: 10-Nov-2009
Publisher: Trans Tech Publications
Citation: Khan, M. K., Fitzpatrick, M. E., Edwards, L. E., & Hainsworth, S. V. (2009). Determination of the residual stress field around scratches using synchrotron x-rays and nanoindentation. Materials Science Forum 652 (May 2010): 25–30. doi:10.4028/
Abstract: The residual strain field around the scratches of 125µm depth and 5µm root radius have been measured from the Synchrotron X-ray diffraction. Scratches were produced using different tools in fine-grained aluminium alloy AA 5091. Residual stresses up to +1700 micro-strains were measured at the scratch tip for one tool but remained up to only +1000 micro-strains for the other tool scratch. The load-displacement curves obtained from nanoindentation were used to determine the residual stresses around the scratches. It was found that the load-displacement curves are sensitive to any local residual stress field present and behave according to the type of residual stresses. This combination of nanoindentation and synchrotron X-rays has been proved highly effective for the study of small-scale residual stresses around the features such as scratches.
ISBN: 0878492585
ISSN: 0255-5476
Appears in Collections:Conference Publications

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