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Please use this identifier to cite or link to this item: http://apo.ansto.gov.au/dspace/handle/10238/2365

Title: Determination of the residual stress field around scratches using synchrotron x-rays and nanoindentation.
Authors: Khan, MK
Fitzpatrick, ME
Edwards, LE
Hainsworth, SV
Keywords: Residual Stresses
Damage
X-Ray Diffraction
Crack Propagation
Fatigue
Synchrotrons
Issue Date: 10-Nov-2009
Publisher: Trans Tech Publications
Citation: Khan, M. K., Fitzpatrick, M. E., Edwards, L. E., & Hainsworth, S. V. (2009). Determination of the residual stress field around scratches using synchrotron x-rays and nanoindentation. 5th International Conference on Mechanical Stress Evaluation by Neutrons and Synchrotron Radiation (MECA SENS V) and 3rd International Symposium of Quantum Beam Science Directorate of Japan Atomic Energy Agency (QuBS2009), 10th – 12th November 2009. Hotel Lake View: Mito, Japan. In Akiniwa, Y. & Akita, K., et al. (Eds.), Materials Science Forum - "Mechanical Stress Evaluation by Neutrons and Synchrotron Radiation", 652, 25-30.
Abstract: The residual strain field around the scratches of 125µm depth and 5µm root radius have been measured from the Synchrotron X-ray diffraction. Scratches were produced using different tools in fine-grained aluminium alloy AA 5091. Residual stresses up to +1700 micro-strains were measured at the scratch tip for one tool but remained up to only +1000 micro-strains for the other tool scratch. The load-displacement curves obtained from nanoindentation were used to determine the residual stresses around the scratches. It was found that the load-displacement curves are sensitive to any local residual stress field present and behave according to the type of residual stresses. This combination of nanoindentation and synchrotron X-rays has been proved highly effective for the study of small-scale residual stresses around the features such as scratches.
URI: http://dx.doi.org/10.4028/www.scientific.net/MSF.652.25
http://apo.ansto.gov.au/dspace/handle/10238/2365
ISBN: 0878492585
ISSN: 0255-5476
Appears in Collections:Conference Publications

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