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|Title:||Characterization of the seposition of n-Octanohydroxamate on copper surfaces|
|Citation:||Parker, G. K., & Holt, S. A. (2014). Characterization of the deposition of n-Octanohydroxamate on copper surfaces. Journal of the Electrochemical Society, 161(5), D277-D286 doi:10.1149/2.070405jes|
|Abstract:||The interaction of n-octanohydroxamate with a copper electrode was investigated using cyclic voltammetry, contact angles, surface-enhanced Raman scattering, neutron reflectometry and X-ray reflectometry. The data demonstrated that hydroxamate specifically adsorbed at underpotentials in the keto tautomeric form, but the layer was hydrophilic and contained >50% water. In the CuI stability region the hydroxamate moiety took on the enol tautomeric form but the interface remained hydrated. Co-adsorption of electrolyte species was observed at underpotentials. The adsorbed hydroxamate at the surface did not prevent the formation of oxide in the CuI stability region. A hydrophobic non-passivating multilayer of copper n-octanohydroximate formed in the CuII stability region. © 2014, The Electrochemical Society.|
|Gov't Doc #:||7285|
|Appears in Collections:||Journal Articles|
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